blob: 2a03e0480fa60c4b3f633235e743d1b9e6d49e49 [file] [log] [blame]
Elyes HAOUAS42eda832020-05-07 11:18:05 +02001# SPDX-License-Identifier: GPL-2.0-only
Frans Hendriks43b6e2e2019-06-04 13:53:05 +02002
3#
4# 8 Gb DDR3 (1600 MHz 11-11-11) Samsung K4B8G1646D-MYK0
5#
6# DUAL DIE
7#
8# 512Mb x16 ( 8 bank, 16 Rows, 10 Col, 2 KB page size )
9# 5-6-7-8-9-10-11
10# DDR3L-1600
11# tCk 1.25ns
12# tRCD 13.75ns
13# tRP 13.75ns
14# tRAS 35ns
15# tRC 48.75ns
16# CL-tRCD-tRP 11-11-11
17
18# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage
19# bits[3:0]: 3 = 384 SPD Bytes Used
20# bits[6:4]: 1 = 256 SPD Bytes Total
21# bit7 : 0 = CRC covers bytes 0 ~ 128
2223
23
24# 1 SPD Revision
25# 0x10 = Revision 1.0
2610
27
28# 2 Key Byte / DRAM Device Type
29# bits[7:0]: 0x0c = DDR3 SDRAM
300B
31
32# 3 Key Byte / Module Type
33# bits[3:0]: 3 = SODIMM
34# bits[6:4]: 0 = Not hybrid
35# bits[7]: 0 = Not hybrid
3603
37
38# 4 SDRAM CHIP Density and Banks
39# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip
40# bits[6:4]: 0 = 3 (8 banks)
Martin Roth50863da2021-10-01 14:37:30 -060041# bits[7]: reserved
Frans Hendriks43b6e2e2019-06-04 13:53:05 +02004204
43
44# 5 SDRAM Addressing
45# bits[2:0]: 1 = 10 Column Address Bits
46# bits[5:3]: 100b = 16 Row Address Bits
47# bits[7:6]: 0 = reserved
4821
49
50# 6 Module Nominal Voltage
51# bits[0]: 0 = 1.5V operable
52# bits[1]: 1 = 1.35V operable
53# bits[2]: 0 = NOT 1.25V operable
54# bits[7:3]: reserved
5502
56
57# 7 Module Organization
58# bits[2:0]: 010b = 16 bits SDRAM device
59# bits[5:3]: 001b = 2 ranks
60# bits[7:6]: reserved
610A
62
63# 8 Module Memory Bus width
64# bits[2:0]: 3 = 64 bits pirmary bus width
65# bits[4:3]: 0 = 0 bits bus witdth extension
66# bits[7:5]: reserved
6703
68
69# 9 Fine Timebase (FTB) dividend / divisor
70# bits[3:0]: 1 = Divisor
71# bits[7:4]: 1 = Dividend
7211
73
74# 10 Medium Timebase (MTB) dividend
75# bits[7:0]: 0 = 1 (timebase 0.125ns)
7601
77
78# 11 Medium Timebase (MTB) divisor
79# bits[7:0]: 8 (timebase 0.125ns)
8008
81
82# 12 SDRAM Minimum cycle time (tCKmin)
83# 0xA tCK = 1.25ns (DDR3-1600 (800 MHz clock))
840A
85
86# 13 Reserved
8700
88
89# 14 CAS Latencies supported, Least Significate Byte
90# Support 5,6,7,8,9,10,11
91FE
92
93# 15 CAS Latencies supported, Most Significate Byte
94# Not supporting CL 12-18
9500
96
97# 16 Minimum CAS Latency Time (tAAmin)
98# 0x69 tAA = 13.125ns (offset = 00) DDR3-1600K downbin
9969
100
101# 17 Minimum Write Recovery Time (tWRmin)
102# 0x78 tWR = 15 ns
10378
104
105# 18 Minimum RAS to CAS Delay Time (tRCDmin)
106# 0x69 tRCD = 13.125ns (offset 00) DDR3-1600K downbin
10769
108
109# 19 Minimum Row Active to Row Active Delay Time (tRRDmin)
110# 48 tRRD = 6.0ns DDR3-1600, 1KB
11130
112
113# 20 Minimum Row Precharge Delay Time (tRPmin)
114# 0x69 tRP = 13.125ns (offset 00) DDR3-1600K downbin
11569
116
117# 21 Upper Nibble for tRAS and tRC
118# 3:0 : 1 higher tRAS = 35ns
119# 7:0 : 1 higher tRC = 48.125ns
12011
121
122# 22 Minimum Active to Precharge Delay Time (tRASmin), Least Significant byte
123# lower 0x118 : tRAS = 35ns DDR3-1600
12418
125
126# 23 Minimum Active to Precharge Delay Time (tRCmin), Most Significant byte
127# lower 0x181 : tRC = 48.125ns (offset 00) DDR3-1600K downbin
12881
129
130# 24 Minimum Refresh Recovery Delay time (tRFCmin), Least Significant byte
131# lower 0x680 : tRFC = 208ns 4 Gb
13280
133
134# 25 Minimum Refresh Recovery Delay time (tRFCmin), Most Significant byte
135# higher 0x680 : tRFC = 208ns 4 Gb
13606
137
138# 26 tWTRmin
139# 0x3C : tWTR = 7.5 ns (DDR3)
1403C
141
142# 27 tRTPmin
143# 0x3C : tRTP = 7.5 ns (DDR3)
1443C
145
146# 28 Upper Nibble for tFAW
147# Bit [3:0] : 1 = higher 0x140 tFAW = 40ns DDR3-1600K, 2 KB page size
14801
149
150# 29 tFAWmin Lower
151# lower 0x140 : tFAW = 40ns DDR3-1600K, 2 KB page size
15240
153
154# 30 SDRAM Optional Features
155# byte [0] : 1 = RZQ/6 is support
156# byte [1] : 1 = RZQ/7 is supported
157# byte [7] : 1 = DLL-Off Mode support
15883
159
160# 31 Thermal options
161# byte [2]: 1 = Auto Self Refresh (ASR) is supported
16204
163
164# 32 Module Thermal support
165# byte [0] : 0 = Thermal sensor accuracy undefined
166# byte [7] : 0 = No thermal sensor
16700
168
169# 33 SDRAM device type
170# byte [1:0] : 01b = multi load stack
Elyes HAOUASbda27cd2020-06-27 07:17:16 +0200171# byte [6:4] : 100b = 8 die
Frans Hendriks43b6e2e2019-06-04 13:53:05 +0200172# byte [7] : 0 = Standard Device
17341
174
175# 34 Fine tCKmin
176# 0x00 tCK = 1.25ns (DDR3-1600 (800 MHz clock))
17700
178
179# 35 Fine tAAmin
180# 0x00 tAA = 13.125ns (tAAmin offset = 00) DDR3-1600K downbin
18100
182
183# 36 Fine tRCDmin
184# 0x00 tRCD = 13.125ns DDR3-1600K downbin
18500
186
187# 37 Fine tRPmin
188# 0x00 tRP = 13.125ns (offset 00) DDR3-1600K downbin
18900
190
191# 38 Fine tRCmin
192# 0x00 tRC = 48.125ns (offset 00) DDR3-1600K downbin
19300
194
195# 39-59 reserved, general section
19600 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
19700 00 00 00 00
198
199# 60-116 Module specific section
20000 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20200 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20300 00 00 00 00 00 00 00 00
204
205# 117-118 Module Manufacturer
20680 CE
207
208# 119 Module Manufacturing Location
20901
210
211# 120-121 Module Manufacturing Date
21212 1B
213
214# 122-125 Module Serial number
21500 00 00 00
216
217# 126-127 SPD CRC
21800 00
219
220# 128-145 Module Part number
2214B 34 42 38 47 31 36 34 36 44 2D 4D 59 4B 30 20
22220 20
223
224# 145-146 Module revision code
22500 00
226
227# 148-149 DRAM Manufacturer ID code
22880 CE
229
230# 150-175 Manufacturer Specific Data
23100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
23200 00 00 00 00 00 00 00 00 00
233
234# 176-255 Open for Customer Use
235
236# 176 - 255
23700 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
23800 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
23900 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
24000 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
24100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00