blob: 6d65b294c914229fbea4e892530e55e26cfd92d1 [file] [log] [blame]
Frans Hendriks5c540f52019-10-04 11:37:05 +02001# This file is part of the coreboot project.
Elyes HAOUAS42eda832020-05-07 11:18:05 +02002# SPDX-License-Identifier: GPL-2.0-only
Frans Hendriks5c540f52019-10-04 11:37:05 +02003
4#
5# 8 Gb DDR3 (1600 MHz 11-11-11) Kingston B5116ECMDXGGB
6#
7# SINGLE DIE
8#
9
10# 64Mx16x8 ( 8 bank, 16 Rows, 10 Col, 2 KB page size )
11# 6-7-8-9-10-11
12# DDR3L-1600
13# tCk 1.25ns
14# tRCD 13.75ns
15# tRP 13.75ns
16# tRAS 35ns
17# tRC 48.75ns
18# CL-tRCD-tRP 11-11-11
19
20# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage
21# bits[3:0]: 3 = 384 SPD Bytes Used
22# bits[6:4]: 1 = 256 SPD Bytes Total
23# bit7 : 0 = CRC covers bytes 0 ~ 128
2423
25
26# 1 SPD Revision
27# 0x10 = Revision 1.0
2810
29
30# 2 Key Byte / DRAM Device Type
31# bits[7:0]: 0x0c = DDR3 SDRAM
320B
33
34# 3 Key Byte / Module Type
35# bits[3:0]: 3 = SODIMM
36# bits[6:4]: 0 = Not hybrid
37# bits[7]: 0 = Not hybrid
3803
39
40# 4 SDRAM CHIP Density and Banks
41# bits[3:0]: 5 = 8 Gigabits Total SDRAM capacity per chip
42# bits[6:4]: 0 = 3 (8 banks)
43# bits[7]: reserverd
4405
45
46# 5 SDRAM Addressing
47# bits[2:0]: 1 = 10 Column Address Bits
48# bits[5:3]: 4 = 16 Row Address Bits
49# bits[7:6]: 0 = reserved
5021
51
52# 6 Module Nominal Voltage
53# bits[0]: 0 = 1.5V operable
54# bits[1]: 1 = 1.35V operable
55# bits[2]: 0 = NOT 1.25V operable
56# bits[7:3]: reserved
5702
58
59# 7 Module Organization
60# bits[2:0]: 010b = 16 bits SDRAM device
61# bits[5:3]: 000b = 1 ranks
62# bits[7:6]: reserved
6302
64
65# 8 Module Memory Bus width
66# bits[2:0]: 3 = 64 bits pirmary bus width
67# bits[4:3]: 0 = 0 bits bus witdth extension
68# bits[7:5]: reserved
6903
70
71# 9 Fine Timebase (FTB) dividend / divisor
72# bits[3:0]: 1 = Divisor
73# bits[7:4]: 1 = Dividend
7411
75
76# 10 Medium Timebase (MTB) dividend
77# bits[7:0]: 0 = 1 (timebase 0.125ns)
7801
79
80# 11 Medium Timebase (MTB) divisor
81# bits[7:0]: 8 (timebase 0.125ns)
8208
83
84# 12 SDRAM Minimum cycle time (tCKmin)
85# 0xA tCK = 1.25ns (DDR3-1600 (800 MHz clock))
860A
87
88# 13 Reserved
8900
90
91# 14 CAS Latencies supported, Least Significate Byte
92# Support 6,7,8,9,10,11
93FC
94
95# 15 CAS Latencies supported, Most Significate Byte
96# No supporting CL 12-18
9700
98
99# 16 Minimum CAS Latency Time (tAAmin)
100# 0x69 tAA = 13.125ns (offset = 00) DDR3-1600K downbin
10169
102
103# 17 Minimum Write Recovery Time (tWRmin)
104# 0x78 tWR = 15 ns
10578
106
107# 18 Minimum RAS to CAS Delay Time (tRCDmin)
108# 0x69 tRCD = 13.125ns (offset 00) DDR3-1600K downbin
10969
110
111# 19 Minimum Row Active to Row Active Delay Time (tRRDmin)
112# 0x3C tRRD = 7.5ns DDR3-1600, 2KB
1133C
114
115# 20 Minimum Row Precharge Delay Time (tRPmin)
116# 0x69 tRP = 13.125ns (offset 00) DDR3-1600K downbin
11769
118
119# 21 Upper Nibble for tRAS and tRC
120# 3:0 : 1 higher tRAS = 35ns
121# 7:0 : 1 higher tRC = 48.125ns
12211
123
124# 22 Minimum Active to Precharge Delay Time (tRASmin), Least Significant byte
125# lower 0x118 : tRAS = 35ns DDR3-1600
12618
127
128# 23 Minimum Active to Precharge Delay Time (tRCmin), Most Significant byte
129# lower 0x181 : tRC = 48.125ns (offset 00) DDR3-1600K downbin
13081
131
132# 24 Minimum Refresh Recovery Delay time (tRFCmin), Least Significant byte
133# lower 0xAF0 : tRFC = 350ns 8 Gb
134F0
135
136# 25 Minimum Refresh Recovery Delay time (tRFCmin), Most Significant byte
137# higher 0xAF0 : tRFC = 350ns 8 Gb
1380A
139
140# 26 tWTRmin
141# 0x3C : tWTR = 7.5 ns (DDR3)
1423C
143
144# 27 tRTPmin
145# 0x3C : tRTP = 7.5 ns (DDR3)
1463C
147
148# 28 Upper Nibble for tFAW
149# Bit [3:0] : 1 = higher 0x140 tFAW = 40ns
15001
151
152# 29 tFAWmin Lower
153# lower 0x140 : tFAW = 40ns
15440
155
156# 30 SDRAM Optional Features
157# byte [0] : 1 = RZQ/6 is support
158# byte [1] : 1 = RZQ/7 is supported
159# byte [7] : 1 = DLL-Off Mode support
16083
161
162# 31 Thermal options
163# byte [0] : 1 = 0 - 95C
164# byte [2] : 0 = Auto Self Refresh (ASR) is not supported
165# byte [7] : 0 = Partial Array Self Refres (PASR) is not supported
16601
167
168# 32 Module Thermal support
169# byte [0] : 0 = Thermal sensor accuracy undefined
170# byte [7] : 0 = No thermal sensor
17100
172
173# 33 SDRAM device type
174# byte [1:0] : 00b = Signal Loading not specified
175# byte [6:4] : 000b = Die count not specified
176# byte [7] : 0 = Standard Monolithic DRAM Device
17700
178
179# 34 Fine tCKmin
180# 0x00 tCK = 1.25ns (DDR3-1600 (800 MHz clock))
18100
182
183# 35 Fine tAAmin
184# 0x00 tAA = 13.125ns (tAAmin offset = 00) DDR3-1600K downbin
18500
186
187# 36 Fine tRCDmin
188# 0x00 tRCD = 13.125ns DDR3-1600K downbin
18900
190
191# 37 Fine tRPmin
192# 0x00 tRP = 13.125ns (offset 00) DDR3-1600K downbin
19300
194
195# 38 Fine tRCmin
196# 0x00 tRC = 48.125ns (offset 00) DDR3-1600K downbin
19700
198
199# 39-59 reserved, general section
20000 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20100 00 00 00 00
202
203# 60-116 Module specific section
20400 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20500 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20600 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
20700 00 00 00 00 00 00 00 00
208
209# 117-118 Module Manufacturer
21001 98
211
212# 119 Module Manufacturing Location
21300
214
215# 120-121 Module Manufacturing Date
21613 0A
217
218# 122-125 Module Serial number
21900 00 00 00
220
221# 126-127 SPD CRC
22200 00
223
224# 128-145 Module Part number
22566 53 49 49 54 69 67 77 68 88 71 71 66 00 00 00
22600 00
227
228# 145-146 Module revision code
22900 00
230
231# 148-149 DRAM Manufacturer ID code
23201 98
233
234# 150-175 Manufacturer Specific Data
23500 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
23600 00 00 00 00 00 00 00 00 00
237
238# 176-255 Open for Customer Use
239
240# 176 - 255
24100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
24200 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
24300 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
24400 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
24500 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00