# SPDX-License-Identifier: GPL-2.0-only

#
# 8 Gb DDR3 (1600 MHz 11-11-11) Samsung K4B8G1646D-MYK0
#
# DUAL DIE
#
# 512Mb x16 ( 8 bank, 16 Rows, 10 Col, 2 KB page size )
# 5-6-7-8-9-10-11
# DDR3L-1600
# tCk 1.25ns
# tRCD 13.75ns
# tRP 13.75ns
# tRAS 35ns
# tRC 48.75ns
# CL-tRCD-tRP 11-11-11

#	0 Number of SPD Bytes used / Total SPD Size / CRC Coverage
#		bits[3:0]: 3 = 384 SPD Bytes Used
#		bits[6:4]: 1 = 256 SPD Bytes Total
#		bit7 : 0 = CRC covers bytes 0 ~ 128
23

#	1 SPD Revision
#		0x10 = Revision 1.0
10

#	2 Key Byte / DRAM Device Type
#		bits[7:0]: 0x0c = DDR3 SDRAM
0B

#	3 Key Byte / Module Type
#		bits[3:0]: 3 = SODIMM
#		bits[6:4]: 0 = Not hybrid
#		bits[7]: 0 = Not hybrid
03

#	4 SDRAM CHIP Density and Banks
#		bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip
#		bits[6:4]: 0 = 3 (8 banks)
#		bits[7]: reserverd
04

#	5 SDRAM Addressing
#		bits[2:0]: 1 = 10 Column Address Bits
#		bits[5:3]: 100b = 16 Row Address Bits
#		bits[7:6]: 0 = reserved
21

#	6 Module Nominal Voltage
#		bits[0]: 0 = 1.5V operable
#		bits[1]: 1 = 1.35V operable
#		bits[2]: 0 = NOT 1.25V operable
#		bits[7:3]: reserved
02

#	7 Module Organization
#		bits[2:0]: 010b = 16 bits SDRAM device
#		bits[5:3]: 001b = 2 ranks
#		bits[7:6]: reserved
0A

#	8 Module Memory Bus width
#		bits[2:0]: 3 = 64 bits pirmary bus width
#		bits[4:3]: 0 = 0 bits bus witdth extension
#		bits[7:5]: reserved
03

#	9 Fine Timebase (FTB) dividend / divisor
#		bits[3:0]: 1 = Divisor
#		bits[7:4]: 1 = Dividend
11

#	10 Medium Timebase (MTB) dividend
#		bits[7:0]: 0 = 1 (timebase 0.125ns)
01

#	11 Medium Timebase (MTB) divisor
#		bits[7:0]: 8 (timebase 0.125ns)
08

#	12 SDRAM Minimum cycle time (tCKmin)
#		0xA tCK = 1.25ns (DDR3-1600 (800 MHz clock))
0A

#	13 Reserved
00

#	14 CAS Latencies supported, Least Significate Byte
#		Support 5,6,7,8,9,10,11
FE

#	15 CAS Latencies supported, Most Significate Byte
#		Not supporting CL 12-18
00

#	16 Minimum CAS Latency Time (tAAmin)
#		0x69 tAA = 13.125ns (offset = 00) DDR3-1600K downbin
69

#	17 Minimum Write Recovery Time (tWRmin)
#		0x78 tWR = 15 ns
78

#	18 Minimum RAS to CAS Delay Time (tRCDmin)
#		0x69 tRCD = 13.125ns (offset 00) DDR3-1600K downbin
69

#	19 Minimum Row Active to Row Active Delay Time (tRRDmin)
#		48 tRRD = 6.0ns DDR3-1600, 1KB
30

#	20 Minimum Row Precharge Delay Time (tRPmin)
#		0x69 tRP = 13.125ns (offset 00) DDR3-1600K downbin
69

#	21 Upper Nibble for tRAS and tRC
#		3:0 : 1 higher tRAS = 35ns
#		7:0 : 1 higher tRC = 48.125ns
11

#	22 Minimum Active to Precharge Delay Time (tRASmin), Least Significant byte
#		lower 0x118 : tRAS = 35ns DDR3-1600
18

#	23 Minimum Active to Precharge Delay Time (tRCmin), Most Significant byte
#		lower 0x181 : tRC = 48.125ns  (offset 00) DDR3-1600K downbin
81

#	24 Minimum Refresh Recovery Delay time (tRFCmin), Least Significant byte
#		lower 0x680 : tRFC = 208ns 4 Gb
80

#	25 Minimum Refresh Recovery Delay time (tRFCmin), Most Significant byte
#		higher 0x680 : tRFC = 208ns 4 Gb
06

#	26 tWTRmin
#		0x3C : tWTR = 7.5 ns (DDR3)
3C

#	27 tRTPmin
#		0x3C : tRTP = 7.5 ns (DDR3)
3C

#	28 Upper Nibble for tFAW
#		Bit [3:0] : 1 = higher 0x140 tFAW = 40ns DDR3-1600K, 2 KB page size
01

#	29 tFAWmin Lower
#		lower 0x140 : tFAW = 40ns DDR3-1600K, 2 KB page size
40

#	30 SDRAM Optional Features
#		byte [0] : 1 = RZQ/6 is support
#		byte [1] : 1 = RZQ/7 is supported
#		byte [7] : 1 = DLL-Off Mode support
83

#	31 Thermal options
#		byte [2]: 1 = Auto Self Refresh (ASR) is supported
04

#	32 Module Thermal support
#		byte [0] : 0 = Thermal sensor accuracy undefined
#		byte [7] : 0 = No thermal sensor
00

#	33 SDRAM device type
#		byte [1:0] : 01b = multi load stack
#		byte [6:4] : 100b = 8 die
#		byte [7]   : 0 = Standard Device
41

#	34 Fine tCKmin
#		0x00 tCK = 1.25ns (DDR3-1600 (800 MHz clock))
00

#	35 Fine tAAmin
#		0x00 tAA = 13.125ns (tAAmin offset = 00) DDR3-1600K downbin
00

#	36 Fine tRCDmin
#		0x00 tRCD = 13.125ns DDR3-1600K downbin
00

#	37 Fine tRPmin
#		0x00 tRP = 13.125ns (offset 00) DDR3-1600K downbin
00

#	38 Fine tRCmin
#		0x00 tRC = 48.125ns (offset 00) DDR3-1600K downbin
00

#	39-59 reserved, general section
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00

#	60-116 Module specific section
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00

#	117-118 Module Manufacturer
80 CE

#	119 Module Manufacturing Location
01

#	120-121 Module Manufacturing Date
12 1B

#	122-125 Module Serial number
00 00 00 00

#	126-127 SPD CRC
00 00

#	128-145 Module Part number
4B 34 42 38 47 31 36 34 36 44 2D 4D 59 4B 30 20
20 20

#	145-146 Module revision code
00 00

#	148-149 DRAM Manufacturer ID code
80 CE

#	150-175 Manufacturer Specific Data
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00

#	176-255 Open for Customer Use

#	176 - 255
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00